[KoMiCo Lab] KoMiCo Semiconductor Equipment Parts Cleaning Process

In semiconductor manufacturing, equipment parts are among the most critical assets of our customers.
However, due to repeated process environments, these parts are inevitably exposed to contamination and damage, which can directly lead to reduced production efficiency.

Leveraging years of accumulated technology and expertise, KoMiCo restores customers’ parts to their optimal condition and has established itself as a reliable technology partner.
Today, we will take a closer look at KoMiCo’s Semiconductor Equipment Parts Cleaning Process, which applies our advanced cleaning technology.

■ Parts Receiving

KoMiCo operates a Warehouse Management System (WMS) to manage and trace every stage from incoming to outgoing parts.
The system enables automated product history and location tracking, as well as real-time monitoring of the logistics process.
This ensures that customers’ parts are safely and systematically received, stored, and shipped, securing not only product quality but also logistics stability.

■ Incoming Inspection

After receiving parts, KoMiCo conducts a thorough analysis using precision inspection equipment.
Through meticulous visual inspection and optical measurement systems, contamination levels and physical damage are carefully examined down to the micro level.
All inspection data—including product images and defect information—are recorded in the Manufacturing Execution System (MES) for use in subsequent cleaning processes.

■ Pre-Cleaning Process

KoMiCo’s Pre-Cleaning Process removes various contaminants that adhere to semiconductor equipment parts during production.
Tailored cleaning recipes are developed based on each part’s material and contamination characteristics.
By analyzing the chemical composition and physical properties of contaminants, KoMiCo designs optimized cleaning recipes for the most effective removal.

• Chemical Cleaning: Removes oxides, organics, and metallic contaminants through chemical reactions using acids, alkalis, and solvents.
• Physical Cleaning: Removes particles and residues using physical forces such as brushing, scrubbing, and jet spraying.

To restore damaged parts as close to their original state as possible, KoMiCo also applies Surface Treatment technology.
By uniformly adjusting surface roughness and maintaining optimal surface conditions, KoMiCo contributes to process stability in customer operations.

■ Post-Cleaning Process

The Post-Cleaning Process is a critical stage that precisely controls micro-contaminants and ionic residues remaining after pre-cleaning.
Even invisible particles or trace ions that can affect semiconductor process yield are rigorously removed.
Since extreme cleanliness and stability are essential in semiconductor manufacturing, micro-contamination and ion control are not optional—they are mandatory.

KoMiCo applies proprietary post-cleaning technologies such as ComFre™ and WSCS™, built upon advanced Ultrasonic Cleaning.
Cleaning parameters—such as frequency, duration, and chemical composition—are finely optimized according to each part’s geometry, material, and contamination profile, delivering high-quality cleaning solutions with maximum efficiency in micro-particle and ion removal.

■ Drying Process

Residual moisture on semiconductor equipment parts can lead to critical issues, including ion contamination, corrosion, and particle re-adhesion—all of which directly impact yield and reliability.
To prevent such problems, KoMiCo treats Drying as an independent, key process.

Drying parameters—temperature, time, and vacuum level—are precisely controlled based on each part’s material and thermal properties.
When necessary, Vacuum Drying environments are implemented to completely eliminate micro-level moisture.
This rigorous control ensures that all parts are delivered in a fully dry, stabilized condition, guaranteeing high cleanliness and reliability in semiconductor operations.

■ Final Inspection

After all cleaning and drying processes are completed, each part undergoes a final quality verification using advanced inspection systems.
This includes checking appearance, surface cleanliness, ion residue, and particle generation potential—key factors directly linked to cleaning quality.

KoMiCo uses a wide range of precision analytical instruments to validate results with objective, data-driven verification.
Through this quantitative quality assurance process, every part is confirmed to meet semiconductor-grade cleanliness standards before delivery.

■ Packaging & Delivery

Parts that pass the final inspection are systematically packaged and prepared for shipment according to customer specifications.
Each part is labeled with customer-specific identification and accompanied by a Certificate of Analysis (CoA) verifying cleaning quality.
To prevent contamination, all products undergo Vacuum Packaging within a controlled Cleanroom environment.

This ensures that every part is delivered in optimal cleanliness and stability to the customer.
KoMiCo will continue to provide the best solutions through continuous innovation and systematic quality management, supporting our customers’ productivity and global competitiveness.

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<About KoMiCo>

KoMiCo, established in 1996, was the first company in Korea to commercialize cleaning and coating services for semiconductor equipment components. With global operations spanning the United States, China, Taiwan, and Singapore, KoMiCo has earned quality certifications from some of the world’s leading semiconductor manufacturers, solidifying its position as a Global No.1 in the industry.

Building on its advanced cleaning and coating technologies, KoMiCo continues to enhance its core business while expanding into the development and supply of key OEM components for semiconductor equipment. Moving forward, the company remains committed to improving customers’ productivity and yield, and aims to become a global leader in the semiconductor component cleaning, coating, and manufacturing industry.