High hermeticity, excellent uniformity, and superior corrosion resistance are essential requirements for coatings used in advanced semiconductor fabrication. As device integration continues to intensify, the ability to reliably deposit ultra-thin films even within the complex internal structures of process equipment has become increasingly vital.One of the most promising thin-film technologies t..

The PVD (Physical Vapor Deposition) process in semiconductor manufacturing is a highly advanced technique that involves the precise deposition of ultra-thin films on the scale of tens of nanometers. Throughout this process, maintaining stable physical and chemical properties is essential.During deposition, the target material can scatter inside the chamber, leading to uneven redeposition on vari..

As the semiconductor industry continues to advance, the required levels of reliability and environmental resistance for equipment components are also increasing.Aluminum-based materials are widely used for various semiconductor equipment parts due to their excellent light weight, high thermal conductivity, and superior machinability. However, they possess an inherent limitation—a lack of resista..

In semiconductor manufacturing, particles are more than just contaminants — they are critical variables that directly impact yield. Especially in etching and deposition processes, where nanoscale patterns are formed, even the smallest contamination can lead to a sharp increase in defect rates, reduced productivity, and decreased profitability.In response to these demanding conditions, AD Coating..

반도체 공정에서 ‘파티클(particle)’은 단순한 오염 요소를 넘어 수율에 직접적인 영향을 주는 치명적인 변수입니다. 특히 나노미터 단위로 패턴이 구성되는 식각(Etch) 및 증착(Deposition) 공정에서는 미세한 오염조차 불량률 상승으로 이어지며, 생산성 저하와 수익성 악화를 유발합니다.이러한 까다로운 환경 속에서 주목받고 있는 코팅 기술이 AD Coating (Aerosol Deposition Coating)입니다. AD Coating은 특히 파티클 발생 억제 측면에서 뛰어난 성능을 보여주며, 차세대 반도체 장비용 코팅 솔루션으로 각광받고 있습니다. 이번 글에서는 AD Coating이란 무엇인지, 어떤 기술적 원리와 구조적 특성을 통해 파티클을 효과적으로 제어하는지에 대해 소개하겠습니다.■ ..